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Kurtz Ersa Magazine

 
 
 
VERSAPRINT 3D-SPI

First stencil printer with 100% integrated 3D-SPI solder paste inspection

The VERSAPRINT stencil printers with integrated 100% post print inspection have successfully established themselves on today’s market for electronic manufacturing equipment.  The VERSAPRINTs have long since outgrown the status of being “only a simple printer” and have transformed themselves into full-fledged multifunctional systems. Extending 2D inspection, Ersa now presents the VERSAPRINT 3D-SPI – with even more process control and still minimal floor space requirements.

The Ersa stencil printer VERSAPRINT S1-3D combines precise stencil printing and 100% 3D-SPI in one system – featuring the smallest footprint
The Ersa stencil printer VERSAPRINT S1-3D combines precise stencil printing and 100% 3D-SPI in one system – featuring the smallest footprint

The idea for the integrated 3D-SPI (SPI is short for “solder paste inspection”) was around for a while, but it needed a viable system base to be realized, which Ersa found in the printer platforms VERSAPRINT P1 and S1. When selecting a suitable method to integrate into the existing printer concept, it became apparent that only the laser triangulation method was suitable. In 3D-SPI systems, the object to be measured is scanned by a laser line and all relevant height information along the line scanned is determined. Only with this method it is possible to place, in the limited space between printed circuit boards and stencil, a compact camera. In this position, the camera has two functions to perform: firstly, the alignment of the printed circuit board to the stencil, and secondly, the 3D inspection. The advantage here: Ersa’s development engineers are, through the line scan technology already applied in 2D inspection, familiar with scanning the PCB – perfect preconditions for building the third dimension on this know-how.

 

The 3D inspection assesses properties such as volume, area, height, shorts and offset. Inspection takes places exclusively with laser triangulation and it will record, in case a failure is detected, an additional 2D image for both, a better presentation and to facilitate the analysis. The 3D image can be rotated whichever way and allows for a quick and safe analysis – height indications are highlighted in color and, when approaching the limits, they are colored red and yellow.

Graphical image of the VERSAPRINT 3D-SPI showing the paste deposit for a QFN component, recognizable is the typical formation of ramps
Graphical image of the VERSAPRINT 3D-SPI showing the paste deposit for a QFN component, recognizable is the typical formation of ramps

The combination of stencil printer and 100% inspection in a single system is the core feature of the Ersa model range VERSAPRINT 3D-SPI. With the 3D inspection, Ersa complements the previous 2D inspection not only with a further version, but offers its customers an important step-up to even better process control and safety. The system promises to deliver a degree of automation in the stencil printing process that has not been achieved so far, thereby ensuring a constant process quality, virtually independent of the operator. Are you ready for the third dimension?

Schematic diagram showing laser triangulation, with which all relevant height information is gained in one scan
Schematic diagram showing laser triangulation, with which all relevant height information is gained in one scan

Advantage VERSAPRINT 3D compared to stand-alone systems:

  • VERSAPRINT stencil inspection recognizes defects before they happen
  • integrated closed-loop function for print offset
  • one software for print and inspection, for a consistent operating concept
  • less floor space required in the production department
 
 
 

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