Ersa tech seminar
100% quality in component manufacturing!
Know-how transfer in the Ersa “Design for Manufacturing” technology seminar
A densely packed programme awaited the 58 participants at Ersa’s technology seminar “Design for Manufacturing from the Soldering Perspective”. Jürgen Friedrich, Head of Application Engineering, introduced the topic. The European electronics industry must face up to numerous challenges if it is to remain competitive in a climate of global competition. The branch primarily produces components and appliances in mid-range lots for demanding industrial applications.
This demands manufacturing-specific design and flexible production lines, so that even small lots can be produced efficiently and in top quality. “As a manufacturer of soldering systems, we often have to assess whether layouts are practicable – in cooperation with the customer and always complying with the generally accepted rules of technology,” said Jürgen Friedrich. The two-day seminar examined important aspects of component manufacturing for achieving highest quality in a cost-efficient framework. The span of topics extended from CAD design and PCB technology and components to production processes – with the focal points ranging from the complex interplay of the board layout and solder joint quality to quality assurance and the traceability of process parameters.
The aim was to show the influence of individual procedures on buildability and reliability. Above all, the interdependency of individual processes was to be highlighted, such as how PCB layout affects the capillary fill of THT components. “Those who invest here in developer’s know-how really benefit – because optimum circuit board layout is a basic prerequisite for the manufacture of high-performance and reliable PCBs,” stressed Jürgen Friedrich.
Consistently high-precision processes required
Arnold Wiemers, Technical Director of the LeiterplattenAkademie, spoke on CAD design and PCB technology. “Internet of things, big data, cloud computing, collaborating robots – all these tasks are only possible on the basis of functioning electronic components, implemented with far-sighted expertise,” explained the PCB expert Wiemers. Helge Schimanski from the Fraunhofer Institute for Silicon Technology (ISIT) looked at component trends, the soldering of temperature-sensitive components and the challenges involved in processing new configurations. “No matter where they are in use – component sizes of 0402, 0201 or smaller demand high-precision processes in all the component manufacturing steps,” emphasised the Head of the ISIT Application Centre for Innovative Component Manufacturing. The official programme for the first day of the seminar came to an end at 5 p.m. – participants then travelled by bus shuttle to Hasloch, where they had the chance to look around the Eisenhammer and dined together in the old manor house (Herrenhaus) in the evening. On the second day, the speakers took up the previous day’s thread and presented further current topics from the areas of research, CAD design and PCB technology. At the end of the second day, the 58 participants headed home with lots of specific input for optimising their own production. “Design for Manufacturing” is sure to appear again in the Ersa seminar calendar …
